Justification of Technological Possibilities for Reducing Surface Roughness During Abrasive Processing

Abstract

This work aims to determine the parameters of surface roughness during abrasive processing analytically and to substantiate the technological possibilities of its reduction in the conditions of transition from the micro-cutting process to the process of elastic-plastic deformation of the processed material. On this basis, the minimum possible values of surface roughness parameters during free abrasive treatment are analytically determined. It is shown that the main way to reduce the surface roughness is to reduce the grain size of the abrasive powder and increase the surface concentration of abrasive grains in the cutting zone. Based on the analysis of the graph of the relative supporting length of the micro-profile of the treated surface experimentally established during abrasive polishing, the significant effect of individual deep scratches on the surface roughness is shown. It is established that they occur as a result of the work of larger grains included in the considered grain fraction with a grain size of 1/0 and the different heights of the grains in the cutting zone. Therefore, it is recommended to use abrasive grains with a small range of their size spread during abrasive polishing and use ovalized abrasive grains, which prevent the formation of deep scratches. The obtained results can be effectively used for abrasive polishing of reflective surfaces of space products that operate under light conditions and require high surface roughness.